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Disco Corp
Previous close
¥26,965.00
Day range
¥27,025.00 - ¥27,540.00
Year range
¥22,640.00 - ¥68,850.00
Market cap
2.96T JPY
Avg Volume
5.55M
P/E ratio
24.00
Dividend yield
1.51%
Primary exchange
TYO
Financials
Income Statement
Revenue
Net income
| (JPY) | Mar 2025info | Y/Y change |
|---|---|---|
Revenue | 120.72B | 15.74% |
Operating expense | 32.57B | 29.21% |
Net income | 38.64B | 9.07% |
Net profit margin | 32.01 | -5.74% |
Earnings per share | — | — |
EBITDA | 54.70B | 11.91% |
Effective tax rate | 24.89% | — |
Balance Sheet
Total assets
Total liabilities
| (JPY) | Mar 2025info | Y/Y change |
|---|---|---|
Cash and short-term investments | 229.17B | 6.35% |
Total assets | 654.09B | 17.63% |
Total liabilities | 161.39B | 7.95% |
Total equity | 492.70B | — |
Shares outstanding | 108.40M | — |
Price to book | 5.94 | — |
Return on assets | 20.13% | — |
Return on capital | 27.28% | — |
Cash Flow
Net change in cash
| (JPY) | Mar 2025info | Y/Y change |
|---|---|---|
Net income | 38.64B | 9.07% |
Cash from operations | — | — |
Cash from investing | — | — |
Cash from financing | — | — |
Net change in cash | — | — |
Free cash flow | — | — |
About
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Founded
May 5, 1937
Website
Employees
4,886
