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Disco Corp
Nakaraang pagsara
¥27,545.00
Sakop ng taon
¥22,640.00 - ¥68,850.00
Market cap
2.99T JPY
Average na Volume
5.68M
P/E ratio
24.18
Dividend yield
1.50%
Primary exchange
TYO
Sa balita
Mga Financial
Income Statement
Kita
Net na kita
| (JPY) | Mar 2025info | Y/Y na pagbabago |
|---|---|---|
Kita | 120.72B | 15.74% |
Gastos sa pagpapatakbo | 32.57B | 29.21% |
Net na kita | 38.64B | 9.07% |
Net profit margin | 32.01 | -5.74% |
Kita sa bawat share | — | — |
EBITDA | 54.70B | 11.91% |
Aktuwal na % ng binabayarang buwis | 24.89% | — |
Balance Sheet
Kabuuang asset
Kabuuang sagutin
| (JPY) | Mar 2025info | Y/Y na pagbabago |
|---|---|---|
Cash at mga panandaliang investment | 229.17B | 6.35% |
Kabuuang asset | 654.09B | 17.63% |
Kabuuang sagutin | 161.39B | 7.95% |
Kabuuang equity | 492.70B | — |
Natitirang share | 108.40M | — |
Presyo para makapag-book | 6.06 | — |
Return on assets | 20.13% | — |
Return on capital | 27.28% | — |
Cash Flow
Net change in cash
| (JPY) | Mar 2025info | Y/Y na pagbabago |
|---|---|---|
Net na kita | 38.64B | 9.07% |
Cash mula sa mga operasyon | — | — |
Cash mula sa pag-invest | — | — |
Cash mula sa financing | — | — |
Net change in cash | — | — |
Malayang cash flow | — | — |
Tungkol
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Itinatag
May 5, 1937
Website
Mga Empleyado
4,886
