Beranda6146 • TYO
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Disco Corp
Tutup sebelumnya
¥49.670,00
Rentang hari
¥49.150,00 - ¥51.250,00
Rentang tahun
¥22.640,00 - ¥57.060,00
Kapitalisasi pasar
5,35 T JPY
Volume Rata-Rata
2,64 jt
Rasio P/E
42,50
Hasil dividen
0,85%
Bursa utama
TYO
Dalam berita
Keuangan
Laporan Laba Rugi
Pendapatan
Penghasilan bersih
| (JPY) | Sep 2025info | Perubahan Y/Y |
|---|---|---|
Pendapatan | 104,62 M | 8,71% |
Biaya operasional | 28,60 M | 8,08% |
Penghasilan bersih | 32,15 M | 8,13% |
Margin laba bersih | 30,73 | -0,52% |
Penghasilan per saham | — | — |
EBITDA | 47,64 M | 4,92% |
Tarif pajak efektif | 28,33% | — |
Neraca
Total aset
Total liabilitas
| (JPY) | Sep 2025info | Perubahan Y/Y |
|---|---|---|
Investasi tunai jangka pdk | 222,91 M | -8,48% |
Total aset | 651,39 M | 10,22% |
Total liabilitas | 133,69 M | -13,45% |
Total ekuitas | 517,70 M | — |
Saham yang beredar | 108,43 jt | — |
Harga terhadap nilai buku | 10,41 | — |
Tingkat pengembalian aset | 17,36% | — |
Tingkat pengembalian modal | 22,02% | — |
Arus Kas
Perubahan kas bersih
| (JPY) | Sep 2025info | Perubahan Y/Y |
|---|---|---|
Penghasilan bersih | 32,15 M | 8,13% |
Kas dari operasi | — | — |
Kas dari investasi | — | — |
Kas dari pembiayaan | — | — |
Perubahan kas bersih | — | — |
Arus kas bebas | — | — |
Tentang
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Didirikan
5 Mei 1937
Situs
Karyawan
5.256
