Beranda6146 • TYO
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Disco Corp
Tutup sebelumnya
¥27.545,00
Rentang hari
¥27.680,00 - ¥28.730,00
Rentang tahun
¥22.640,00 - ¥68.850,00
Kapitalisasi pasar
3,11 T JPY
Volume Rata-Rata
5,68 jt
Rasio P/E
25,22
Hasil dividen
1,44%
Bursa utama
TYO
Berita pasar
Keuangan
Laporan Pendapatan
Pendapatan
Laba bersih
| (JPY) | Mar 2025info | Perubahan Y/Y |
|---|---|---|
Pendapatan | 120,72 M | 15,74% |
Biaya operasional | 32,57 M | 29,21% |
Laba bersih | 38,64 M | 9,07% |
Margin laba bersih | 32,01 | -5,74% |
Penghasilan per saham | — | — |
EBITDA | 54,70 M | 11,91% |
Tarif pajak efektif | 24,89% | — |
Neraca
Total aset
Total liabilitas
| (JPY) | Mar 2025info | Perubahan Y/Y |
|---|---|---|
Investasi tunai jangka pdk | 229,17 M | 6,35% |
Total aset | 654,09 M | 17,63% |
Total liabilitas | 161,39 M | 7,95% |
Total ekuitas | 492,70 M | — |
Saham yang beredar | 108,40 jt | — |
Harga terhadap nilai buku | 6,06 | — |
Tingkat pengembalian aset | 20,13% | — |
Tingkat pengembalian modal | 27,28% | — |
Arus Kas
Perubahan kas bersih
| (JPY) | Mar 2025info | Perubahan Y/Y |
|---|---|---|
Laba bersih | 38,64 M | 9,07% |
Kas dari operasi | — | — |
Kas dari investasi | — | — |
Kas dari pembiayaan | — | — |
Perubahan kas bersih | — | — |
Arus kas bebas | — | — |
Tentang
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Didirikan
5 Mei 1937
Situs
Karyawan
4.886
