Laman Utama6146 • TYO
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Disco Corp
Tutup sebelumnya
¥42,510.00
Julat hari
¥43,200.00 - ¥44,770.00
Julat tahun
¥22,640.00 - ¥57,060.00
Permodalan pasaran
4.82T JPY
Bilangan Purata
2.72J
Nisbah P/E
38.25
Hasil dividen
0.94%
Pertukaran utama
TYO
Berita pasaran
Times Colonist
13 jam lalu
Basic materials stocks weigh on S&P/TSX composite, U.S. markets move higher
0.17%
Kewangan
Penyata Pendapatan
Hasil
Pendapatan bersih
| (JPY) | Sep 2025info | Perubahan T/T |
|---|---|---|
Hasil | 104.62B | 8.71% |
Perbelanjaan pengendalian | 28.60B | 8.08% |
Pendapatan bersih | 32.15B | 8.13% |
Margin untung bersih | 30.73 | -0.52% |
Pendapatan bagi setiap syer | — | — |
EBITDA | 47.64B | 4.92% |
Kadar cukai berkesan | 28.33% | — |
Kunci Kira-kira
Jumlah aset
Jumlah liabiliti
| (JPY) | Sep 2025info | Perubahan T/T |
|---|---|---|
Pelaburan tunai dan jangka pendek | 222.91B | -8.48% |
Jumlah aset | 651.39B | 10.22% |
Jumlah liabiliti | 133.69B | -13.45% |
Jumlah ekuiti | 517.70B | — |
Syer tertunggak | 108.43J | — |
Harga kepada buku | 8.91 | — |
Pulangan pada aset | 17.36% | — |
Pulangan pada modal | 22.02% | — |
Aliran Tunai
Perubahan bersih dalam tunai
| (JPY) | Sep 2025info | Perubahan T/T |
|---|---|---|
Pendapatan bersih | 32.15B | 8.13% |
Tunai daripada operasi | — | — |
Tunai daripada pelaburan | — | — |
Tunai daripada pembiayaan | — | — |
Perubahan bersih dalam tunai | — | — |
Aliran tunai bebas | — | — |
Perihal
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Diasaskan
5 Mei 1937
Tapak web
Pekerja
5,256
